i ntegrated c ircuits d ivision www.ixysic.com ds-paa127-r03 1 paa127 dual single-pole, normally open optomos ? relay e 3 pb part # description paa127 8-pin dip (50/tube) PAA127S 8-pin surface mount (50/tube) PAA127Str 8-pin surface mount (1,000/reel) paa127p 8-pin flatpack (50/tube) paa127ptr 8-pin flatpack (1,000/reel) parameter ratings units blocking voltage 280 v p load current 200 ma rms / ma dc on-resistance (max) 10 ? applications features description approvals ordering information pin configuration switching characteristics of normally open devices form-a i f i load 10% 90% t on t off ? 500 ? s maximum switching times ? high performance 280v p blocking voltage ? high reliability ? 3750v rms input/output isolation ? arc-free with no snubbing circuits ? no emi/rfi generation ? fcc compatible ? vde compatible ? low drive power requirements (ttl/cmos compatible) ? small 8-pin package ? machine insertable, wave solderable ? surface mount tape & reel versions available ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? test equipment ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls 1 2 3 4 8 7 6 5 + control - switch #1 C control - switch #1 + control - switch #2 C control - switch #2 load - switch #1 ac/dc configuration load - switch #1 load - switch #2 load - switch #2 ? ul recognized component: file # e76270 ? csa certified component: certificate # 1175739 ? certified to: iec 60950-1: 2005 en 60950-1: 2006 tuv certificate # b 12 11 82667 002 paa127 is a dual high performance 280v, 200ma, 10 ? , normally open (1-form-a) solid state relay that has two independently controlled, optically coupled mosfet switches in an 8-pin package . it emplo ys optically coupled mosfet technology to provide 3750v rms of input to output isolation. its optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. this dual single-pole optomos relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-pin package.
i ntegrated c ircuits d ivision www.ixysic.com 2 r03 paa127 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l - - 200 ma rms / ma dc peak t =10ms i lpk - - 400 ma p on-resistance 2 i f =3ma, i l =200ma r on - 7.3 10 ? off-state leakage current i f =0ma, v l =280v p i leak - 1 25 na switching speeds turn-on i f =5ma, v l =10v t on - 0.42 0.5 ms turn-off t off - 0.12 0.5 output capacitance i f =0ma, v l =50v, f=1mhz c out -16- pf input characteristics input control current to activate 3 i l =200ma i f - 0.5 3 ma input control current to deactivate - - 0.3 0.49 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3- pf 1 if both poles operate, the load current must be derated in order not to exceed the package power dissipation value. 2 measurement taken within one (1) second of on-time. 3 for high-temperature applications (>60 o c) use a led current of at least 5ma. parameter ratings units blocking voltage 280 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc absolute maximum ratings @ 25oc electrical characteristics @ 25oc
i ntegrated c ircuits d ivision paa127 www.ixysic.com 3 r03 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. performance data @25oc (unless otherwise noted)* led forward voltage (v) 1.200 1.205 1.210 1.215 1.220 1.225 device count (n) 0 5 10 15 20 25 30 35 40 typical led forward voltage drop (n=50, i f =5ma) turn-on time ( p s) 325 350 375 400 425 450 475 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, i f =5ma, i l =100ma) turn-off time ( p s) 100 105 110 115 120 125 130 135 device count (n) 0 5 10 15 20 25 30 typical turn-off time (n=50, i f =5ma, i l =100ma) led forward current (ma) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 device count (n) 0 5 10 15 20 typical i f for switch operation (n=50, i l =200ma) on-resistance ( : ) 7.1 7.2 7.3 7.4 7.5 7.6 device count (n) 0 5 10 15 20 25 typical on-resistance distribution (n=50, i f =3ma, i l =200ma) blocking voltage (v p ) 332 334 336 338 340 342 device count (n) 0 5 10 15 20 typical blocking voltage distribution (n=50, i f =0ma) temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage (v) 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma led current (ma) 0 1020304050 turn-on time (ms) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 typical turn-on time vs. led forward current (i l =100ma) led current (ma) 0 1020304050 turn-off time (ms) 0.140 0.145 0.150 0.155 0.160 0.165 typical turn-off time vs. led forward current (i l =100ma) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.40 0.45 0.50 0.55 0.60 0.65 typical i f for switch operation vs. temperature (i l =200ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time ( p s) 300 350 400 450 500 550 600 650 typical turn-on time vs. temperature (i f =5ma, i l =100ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time ( p s) 50 100 150 200 250 typical turn-off time vs. temperature (i f =5ma, i l =100ma)
i ntegrated c ircuits d ivision www.ixysic.com 4 r03 paa127 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. performance data @25oc (unless otherwise noted)* temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance ( : ) 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 typical on-resistance vs. temperature (i f =3ma, i l =200ma) load voltage (v) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 load current (ma) -250 -200 -150 -100 -50 0 50 100 150 200 250 typical load current vs. load voltage (i f =3ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (ma) 80 100 120 140 160 180 200 220 maximum load current vs. temperature ac/dc configuration (i f =3ma) temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 315 320 325 330 335 340 345 350 355 typical blocking voltage vs. temperature (i f =0ma) temperature (oc) -40 -20 0 20 40 60 80 100 leakage current (na) leakage current vs. temperature measured across pins 5&6 & 7&8 (i f =0ma, v l =280v) 0 5 10 15 20 25 load voltage (v) 0 50 100 150 200 250 300 output capacitance (pf) 0 10 20 30 40 50 60 70 80 90 output capacitance vs. load voltage (i f =0ma) time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load current (a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 energy rating curve
i ntegrated c ircuits d ivision paa127 www.ixysic.com 5 r03 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating paa127 / PAA127S / paa127p msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time paa127 / PAA127S 250oc for 30 seconds paa127p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r03 paa127 mechanical dimensions dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 paa127 PAA127S paa127p
i ntegrated c ircuits d ivision specification: ds-paa127-r03 ?copyright 2013, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 6/20/2013 for additional information please visit our website at: www.ixysic.com 7 paa127 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) PAA127Str tape & reel paa127ptr tape & reel
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